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造成纸箱纸板有粘合不良的原因分析!

来源:http://www.shuangfengbaozhuang.cn 时间:2020-03-18

  济南纸箱瓦楞纸板生产中总会出现装不好的问题,每家工厂都会出现这样的问题,只是看谁控制的好。但这是一个许多纸箱厂经营者认为是胶水的问题。其实,纸板的粘合不一定是胶水的问题。它可以是人员操作、纸张、设备,甚是糊化温度和粘度、机器温度。我们来分析一下这些原因。
  Jinan carton corrugated board production will always have the problem of poor packing, every factory will have such a problem, just to see who controls it well. But this is a problem that many carton factory operators think is glue. In fact, the adhesion of cardboard is not necessarily the problem of glue. It can be personnel operation, paper, equipment, even gelatinization temperature and viscosity, machine temperature. Let's analyze these reasons.
  在操作中,调整胶量的间隙大小是非常重要的。当胶量不足时,会导致粘接不良,导致配合不良。在操作中由于没有及时检查发现,所以废品率高。从操作面看,上胶量主要是上胶间隙的调节问题,只要控制在合理范围内就可以控制板材的粘接。
  In operation, it is very important to adjust the gap size of glue quantity. When the amount of glue is insufficient, it will lead to poor adhesion and poor matching. In operation, the rejection rate is high due to no timely inspection. From the operation point of view, the amount of gluing is mainly the adjustment of the gluing gap. As long as the control is within a reasonable range, the bonding of the plate can be controlled.
  当纸张吸水时也会导致附着力差,纸张吸水胶很难渗透到纸张中,这种现象容易出现的就是假附着力。当纸张吸水时必须增加胶水的用量,提高纸张的温度。提高纸张的温度可以分解纤维,使胶水更易渗透。
  When the paper absorbs water, it will also lead to poor adhesion. It is difficult for the paper absorbent to penetrate into the paper, and the most likely phenomenon is false adhesion. When the paper absorbs water, the amount of glue must be increased to raise the temperature of the paper. Increasing the temperature of the paper can decompose the fibers and make the glue more permeable.
纸箱厂家
  当设备在生产过程中出现间隙跳动或不平衡时,会导致粘结力差,所以工厂需要定期对每个间隙进行校准,如胶辊、压辊等。
  When there is gap runout or imbalance in the production process of the equipment, it will lead to poor adhesion, so the factory needs to calibrate every gap regularly, such as rubber roll, pressure roll, etc.
  纸板粘合不一定是温度不够引起的。我们从纸板加热温度分析,因为三层和五层的厚度的板都是不同的,那么同样的温度终于转移到纸板的焊接点温度是不同的,因为五层板的厚度,同样的加热温度,焊接点的温度低于三层板。
  Board bonding is not necessarily caused by insufficient temperature. From the analysis of cardboard heating temperature, because the thickness of three layers and five layers are different, then the same temperature finally transferred to the cardboard welding point temperature is different, because the thickness of five layers, the same heating temperature, the temperature of welding point is lower than three layers.